XGZP-185 Surface Mount Pressure Sensor

The XGZP185 surface mount pressure sensor is designed for compact and cost-effective pressure measurement in high-volume electronic applications. The sensor integrates a piezoresistive silicon sensing die mounted on a substrate and enclosed in a standard SOP6 package, enabling efficient PCB integration.

Pressure applied to the sensor is directly transferred to the silicon sensing element, generating a proportional electrical signal. The sensor provides stable performance with good repeatability, linearity, and sensitivity, supporting consistent measurement in embedded systems.

The SOP6 package allows easy installation using standard SMT assembly processes, making it suitable for scalable manufacturing. Signal conditioning and temperature compensation can be implemented using external operational amplifiers or integrated circuits, allowing flexible system design.

The XGZP185 is intended for use with non-corrosive gases or air. Typical applications include HVAC systems, portable electronic devices, industrial monitoring equipment, and embedded pressure measurement systems where compact size and reliable sensing performance are required.