XGZP-168 Surface Mount Pressure Sensor

The XGZP168 surface mount pressure sensor is designed for compact and cost-efficient pressure measurement in electronic systems. The sensor integrates a piezoresistive silicon sensing die mounted on a substrate and packaged in standard SOP6 or DIP6 configurations, allowing flexible PCB integration.

Pressure applied to the sensor is directly transferred to the silicon sensing element, generating a proportional electrical signal. The sensor provides stable performance with good repeatability, linearity, and sensitivity, supporting consistent measurement in embedded applications.

The availability of both surface mount and through-hole package options enables flexible installation depending on manufacturing requirements. Signal conditioning, including amplification and temperature compensation, can be implemented using external operational amplifiers or integrated circuits, allowing adaptable system design.

The XGZP168 is intended for use with non-corrosive gases or air. It is suitable for applications such as HVAC systems, consumer electronics, industrial monitoring devices, and embedded measurement systems where compact size and reliable performance are required.