XGZP-168 Pressure Sensor

XGZP168 is a surface mounting pressure sensor based on CFSensor silicon based piezoresistive pressure sensor die. The sensor die is bonded on a substrate with a plastic cap and packaged in a 6-pin SOP or DIP structure. The small size and high reliability of on-chip integration make this sensor a simple and economical choice for high volume application in a variety of industries. With standard SOP6 or DIP6 package, XGZP168 is easy for users to install by SMT or through hole board assembly. 

With good repeatability, linearity, stability and sensibility, XGZP168 is very facile for users to calibrate output & thermal drift and make temperature compensation by using exterior operational amplifier or integrated circuit.(For amplified output or I2C interface if required, please refer to CFSensor calibrated pressure sensor series)

The XGZP168 pressure sensor is intended for using with non-corrosive gas or air. It is highly prohibited to choke the side of pressure diaphragm during actual application. Please consult us if a pressure medium other then air is to be used.