Surface mount pressure sensor design
Piezoresistive silicon sensing element
SOP8 compact package
Suitable for SMT PCB assembly
Good linearity and repeatability
Supports gas and liquid measurement

The XGZP170 surface mount pressure sensor is designed for compact and cost-effective pressure measurement in high-volume electronic applications. The sensor integrates a piezoresistive silicon sensing die mounted on a substrate and enclosed in a standard SOP8 package, enabling efficient PCB integration.

Pressure applied to the sensor is directly transferred to the silicon sensing element, generating a proportional electrical signal. The sensor provides stable performance with good repeatability, linearity, and sensitivity, supporting consistent measurement in embedded systems.

The SOP8 package allows easy installation using standard SMT assembly processes, making it suitable for scalable production. Signal conditioning and temperature compensation can be implemented using external operational amplifiers or integrated circuits, allowing flexible system design depending on application requirements.

The XGZP170 is suitable for measuring pressure in non-corrosive gases, air, or compatible liquids. Typical applications include HVAC systems, industrial monitoring devices, portable electronics, and embedded pressure measurement systems where compact size and reliable sensing performance are required.

RELATED PRODUCTS