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XGZP-168 Surface Mount Pressure Sensor
SOP6 / DIP6 package options
Piezoresistive silicon sensing element
Supports SMT and through-hole assembly
Good linearity and repeatability
For non-corrosive gases
The XGZP168 surface mount pressure sensor is designed for compact and cost-efficient pressure measurement in electronic systems. The sensor integrates a piezoresistive silicon sensing die mounted on a substrate and packaged in standard SOP6 or DIP6 configurations, allowing flexible PCB integration.
Pressure applied to the sensor is directly transferred to the silicon sensing element, generating a proportional electrical signal. The sensor provides stable performance with good repeatability, linearity, and sensitivity, supporting consistent measurement in embedded applications.
The availability of both surface mount and through-hole package options enables flexible installation depending on manufacturing requirements. Signal conditioning, including amplification and temperature compensation, can be implemented using external operational amplifiers or integrated circuits, allowing adaptable system design.
The XGZP168 is intended for use with non-corrosive gases or air. It is suitable for applications such as HVAC systems, consumer electronics, industrial monitoring devices, and embedded measurement systems where compact size and reliable performance are required.
| CHARACTERISTIC | MIN | TYP. | MAX | UNIT | |
|---|---|---|---|---|---|
| Pressure Range① | 1, 3, 7, 40,100,200,700,1000 | kPa | |||
| Supply Voltage | 0.3 | 5 | 15 | Vdc | |
| Supply Current | — | 1 | 3 | mA | |
| Working Temperature | -30/-22 | – | +125/257 | ℃/℉ | |
| Storage Temperature | -40/-40 | – | +140/284 | ℃/℉ | |
| Bridge Resistance | 4 | 5 | 6 | kΩ | |
| Offset/Zero Output | -5 | – | +10 | mV | |
| FS Output | 1kPa | 15 | 30 | 45 | mV |
| 3kPa | 20 | 30 | 40 | mV | |
| 7kPa | 20 | 35 | 50 | mV | |
| 700kPa | 30 | 45 | 60 | mV | |
| 1000kPa | 80 | 110 | 140 | mV | |
| Over Pressure② | 1kPa/3kPa/7kPa | – | 5X | – | FS |
| ＞500kPa | – | 1.5X | – | FS | |
| Burst Pressure② | 1kPa/3kPa/7kPa | – | 10x | – | FS |
| ＞500kPa | – | 2X | – | FS | |
| Pressure Cycle③ | One million | Times | |||
| Temp. Coefficient of Resistance | 1600 | 2100 | 2600 | ppm/℃ | |
| TCO(Temp. Coefficient of Offset)④ | -0.05 | ±0.02 | 0.05 | %FS/℃ | |
| TCS(Temp. Coefficient of Span)④ | -0.05 | ±0.02 | 0.05 | %FS/℃ | |
| Linearity⑤ | 1, 3, 7,kPa | -1.5 | 1.5 | %FS | |
| 700,1000kPa | -0.3 | 0.3 | %FS | ||
| Hysteresis | -0.3 | ±0.15 | 0.3 | %FS | |
| Repeatability | -0.3 | ±0.15 | 0.3 | %FS | |
| ESD(HBM) | -2 | +2 | KV | ||
| Medium Compatibility | Pressure side | Air and non-corrosive gas | |||
| Reference side | Air and non-corrosive gas(no condensation) | ||||
| Note: ① The measurement of vacuum/negative pressure is available. ② The indicated value is regarded as a widespread value, contact CFSensor for more information on specific pressure range. ③ Base on laboratory test, actual pressure cycles or life depends on operating environment and conditions ④ Temperature coefficient is measured from 0℃ to 60℃ and driven by constant current. ⑤ Defined as best fit straight line | |||||
RELATED PRODUCTS
Key specifications
| Package / mounting | SOP6 (SMD) |
|---|---|
| Media | Non-corrosive gas / air |
