SOP6 surface-mount package
Piezoresistive silicon sensing element
Suitable for SMT PCB assembly
Good linearity and repeatability
For non-corrosive gases

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The XGZP185 surface mount pressure sensor is designed for compact and cost-effective pressure measurement in high-volume electronic applications. The sensor integrates a piezoresistive silicon sensing die mounted on a substrate and enclosed in a standard SOP6 package, enabling efficient PCB integration.

Pressure applied to the sensor is directly transferred to the silicon sensing element, generating a proportional electrical signal. The sensor provides stable performance with good repeatability, linearity, and sensitivity, supporting consistent measurement in embedded systems.

The SOP6 package allows easy installation using standard SMT assembly processes, making it suitable for scalable manufacturing. Signal conditioning and temperature compensation can be implemented using external operational amplifiers or integrated circuits, allowing flexible system design.

The XGZP185 is intended for use with non-corrosive gases or air. Typical applications include HVAC systems, portable electronic devices, industrial monitoring equipment, and embedded pressure measurement systems where compact size and reliable sensing performance are required.

CHARACTERISTICMINTYP.MAXUNIT
Pressure Range①1, 3, 7, 40,100,200,700,1000kPa
Supply Voltage0.3515Vdc
Supply Current—13mA
Working Temperature-30/-22+125/257℃/℉
Storage Temperature-40/-40+140/284℃/℉
Bridge Resistance456kΩ
Offset/Zero Output-5+10mV
FS Output1kPa153045mV
3kPa203040mV
7kPa203550mV
10kPa355065mV
40kPa556575mV
100/200kPa6090120mV
700kPa304560mV
1000kPa80110140mV
Over Pressure1kPa/3kPa/7kPa5XFS
40/100/200kPa2XFS
>200kPa1.5XFS
Burst Pressure1kPa/3kPa/7kPa10xFS
40/100/200kPa3XFS
>200kPa2XFS
Temp. Coefficient of Resistance160021002600ppm/℃
TCO(Temp. Coefficient of Offset)②-0.05±0.020.05%FS/℃
TCS(Temp. Coefficient of Span)②-0.05±0.020.05%FS/℃
Linearity③10kPa-1.0±0.501.0%FS
1, 3, 7, 40,100,200,700,1000kPa-0.3±0.150.3%FS
Hysteresis-0.3±0.150.3%FS
Repeatability-0.3±0.150.3%FS
ESD(HBM)-2+2KV
Medium
Compatibility
Pressure sideAir and non-corrosive gas
Reference sideAir and non-corrosive gas( no condensation)
Note:
① The measurement of vacuum/negative pressure is available.
② Temperature coefficient is measured from 0℃ to 60℃.(32℉~140℉)
③ Defined as best fit straight line

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Key specifications

Package / mountingSOP6 (SMD)
MediaNon-corrosive gas / air

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